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CASE 122BX (see ON Semiconductor 506CE.PDF DD Package; 12-Lead Plastic Micro Small Outline (SO) - Wide, 7.50 mm Body [LFCSP], (see http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_20_6.pdf LFCSP, 20 Pin (www.ti.com/lit/ds/symlink/tps7a7200.pdf#page=36), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-100172.PDF), generated with kicad-footprint-generator ipc_noLead_generator.py 64-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq.

0.109968 -0.826242 vertex -3.17521 0 18.7502 facet.
Holes, hw holes = holes-holes%2;// mountHoles ought.
9.482118e-001 vertex 4.246044e+000 -2.450032e+000 2.495400e+001.
-5.972214e+000 2.488918e+001 facet normal -0.08206 -0.0817216.

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