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BackTemps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes count 16 Not plated through holes are merged with plated holes count 0 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-CmtUser.gbr Normal file Unescape Schematics/SynthMages.pretty/Perfboard_3x12.kicad_mod Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/CP_Radial_D5.0mm_P2.00mm.kicad_mod Normal file View File 3D Printing/Cases/Eurorack Modular Case/DSC03759.jpg Executable file View File Panels/luther_triangle_vco_quentin_v2.scad Normal file Unescape Schematics/SynthMages.pretty/Jack_3.5mm_QingPu_WQP-PJ398SM_Vertical_CircularHoles_Socket_Centered.kicad_mod Normal file View File Images/IMG_6770.JPG Normal file Unescape HP = 5.07; // 5.07 for a single 1 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius.
- -0.00384412 0.367707 0.929934 vertex -5.42659 4.99768.
- Is taken from \npot pin 1 x.
- 6.57068 0.759029 7.85151 facet normal -1.326702e-08 -1.000000e+00.