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Definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header SMD 1x34 1.27mm single row Through hole angled socket strip SMD 1x39 2.00mm single row Surface mounted socket strip SMD 2x32 2.00mm double row Through hole angled socket strip, 1x40, 2.00mm pitch, 6.35mm socket length, single row Through hole angled socket strip SMD 2x39 1.27mm double row Through hole socket strip THT 1x08 1.27mm single row style1 pin1 left Surface mounted pin header SMD 1x14 1.27mm single row Through hole pin header THT 1x31 1.27mm single row Through hole socket strip SMD 2x31 1.27mm double row Through hole angled pin header, 1x20, 2.54mm pitch, single row style2 pin1 right Through hole angled pin header, 2x32, 2.54mm pitch, single row Through hole straight pin header, 2x36, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole angled pin header THT 2x08 2.54mm double row Through hole angled socket strip SMD 1x37 2.00mm single row.

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