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Http://www.st.com/resource/en/datasheet/stm32f302vc.pdf WLCSP-100, 10x10 raster, 4.201x4.663mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf WLCSP-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f091vb.pdf WLCSP-64, 8x8 raster, 3.357x3.657mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 22.86 mm (900 mils), Socket THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), missing pin 7 8-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket LongPads 40-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads 8-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 20-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 7.62 mm (300 mils), body size 10.8x24.42mm 9x-dip-switch SPST Omron_A6S-910x, Slide, row spacing 15.24 mm (600 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 package, like 6-lead dip package.

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