3
1
Back

Technology 05081955_0_DHC18.pdf DHD Package; 18-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 506CN (see ON Semiconductor 506BU.PDF 8-Lead Plastic DFN (5mm x 4mm) (see Linear Technology 1956f.pdf TSSOP, 16 Pin (https://assets.nexperia.com/documents/data-sheet/74HC_HCT165.pdf#page=14), generated with kicad-footprint-generator ipc_gullwing_generator.py EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00476-02.pdf), generated with kicad-footprint-generator Through hole angled pin header THT 1x04 1.27mm single row Through hole socket strip SMD 2x08 2.54mm double row surface-mounted straight socket strip, 2x19, 2.54mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x06 2.00mm single row style2 pin1 right Through hole straight socket strip, 2x39, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x38 1.00mm single row style2 pin1 right Through hole straight pin header, 2x18, 2.54mm pitch, double rows Surface.

New Pull Request