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7x7x1.0 mm Body, 2.00 mm Footprint [HTQFP] thermal pad HTSSOP32: plastic thin shrink small outline package; 56 leads; body width 6.1 mm; lead pitch 0.635; (see http://cds.linear.com/docs/en/datasheet/38901fb.pdf 28-Lead Plastic Shrink Small Outline (SO) - Wide, 7.50 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Shrink Small Outline (SN) - Narrow, 3.90 mm Body [UDFN.

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