3
1
Back

3x3 area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x03, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x38, 1.00mm pitch, single row Through hole pin header THT 1x18 1.00mm single row.

New Pull Request