3
1
Back

HTSSOP56: plastic thin shrink small outline package; 20 leads; body width 6.1 mm; lead pitch 0.65 mm (see NXP sot054_po.pdf TO-126-2, Horizontal, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Vertical RM 1.27mm Multiwatt-7 staggered type-1 TO-220F-15 Vertical RM 1.27mm staggered type-2 TO-220-7.

New Pull Request