Labels Milestones
BackLongPads 8-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 10-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 20-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP SMDIP 2.54mm 11.48mm 451mil 6-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 48-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil Socket 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 DIL DIP PDIP 5.08mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET ST MOSFET Infineon DirectFET M2 MOSFET Infineon PLCC, 20 pins, single row Surface mounted pin header THT 1x29 1.27mm single row Through hole straight Samtec HPM power header series 11.94mm post length, 1x19, 5.08mm pitch, single row style1 pin1 left Surface mounted pin header THT 1x11 2.54mm single row style2 pin1 right Through hole socket strip THT 2x33 1.27mm double row surface-mounted straight.
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