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53398-1271 (http://www.molex.com/pdm_docs/sd/533980271_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1510, with PCB cutout, light-direction downwards, see http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105.pdf package for Standex Meder SIL reed relais Standex-Meder SIL-relais, Form 1C, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_SIL.pdf Standex Meder DIP reed relay series, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_DIP.pdf DIL DIP PDIP 5.08mm 2.54 4-lead dip package for Kodenshi SG-105 with PCB locator, 4 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator JST PHD series connector, S15B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated.

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