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15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 469, 4.02x4.27mm, 81 Ball.

• Number: 22-27-2161, 16 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf.
• -4.354519e-003 2.096208e-001 facet normal.
• Diode SMC (DO-214AB) Handsoldering Diode SMF (DO-219AB), http://www.vishay.com/docs/95572/smf_do-219ab.pdf.

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