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Height, Vertical, Surface Mount, http://www.molex.com/pdm_docs/sd/1054440001_sd.pdf USB TYPE C, RA RCPT PCB, SMT, https://gct.co/files/drawings/usb4115.pdf USB Type-C Receptacle Hybrid CNCTech C-ARA1-AK51X USB Type A, Kycon KDMIX-SL1-NS-WS-B15, Vertical Right Angle, Surface Mount, ZIF, Bottom Contact Style, 15 Circuits (https://www.molex.com/pdm_docs/sd/2005280150_sd.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 42820-52XX, With thermal vias in pads, 5 Pins per row (http://www.molex.com/pdm_docs/sd/431602102_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 6 times 2.5 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py 16-Lead Lead Frame Chip Scale Package - 4x4x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package (MD) - 4x4x0.9 mm Body [QFN] with corner pads and thermal vias; see section 7.4 of http://www.st.com/resource/en/datasheet/DM00366448.pdf WLCSP-168, 12x14 raster, 4.891x5.692mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.5mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf WLCSP-64, 8x8 raster, 4.466x4.395mm package, pitch 0.4mm; see section 7.1.1 of http://www.st.com/resource/en/datasheet/stm32f401ce.pdf WLCSP-49, 7x7 raster, 3.417x3.151mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm.

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