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-> 445539 bytes Images/precadsr-panel-holes.png | Bin 0 -> 44015 bytes create mode 100644 3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin | 0 3D Printing/Rails/18hp_innie.stl Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/MountingHole_3.2mm_M3.kicad_mod Normal file View File 3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/HOLD PORTAL.png Normal file View File Hardware/Panel/precadsr_panel_al_Gerbers/precadsr_panel_al-NPTH.drl Normal file View File 3D Printing/Pot_Knobs/Pot2.STL Executable file View File 3D Printing/Panels/Radio_shaek_standoff_padded.stl Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/PinSocket_1x10_P2.54mm_Vertical.kicad_mod Normal file View File 3D Printing/Pot_Knobs/Guitar_Amp_Knob-2_ring_bell.stl Executable file View File Synth_Manuals/Kassutronics_Slope_Build_Docs_2.0A-1.pdf Normal file Unescape Panels/10_step_seq_40hp_v1.scad Normal file Unescape Hardware/PCB/precadsr_Gerbers/precadsr-F_Paste.gbr Normal file Unescape "Name": "Top Silk Screen" "Name": "Top Solder Paste" "Name": "Top Solder Paste" "Name": "Top Solder Paste" "Name": "Top Silk Screen" "Name": "Top Solder Paste" "Name": "Bottom Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Paste" "Name": "Bottom Solder Paste" "Name": "Top Silk Screen" "Name": "Top Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Paste" "Name": "Bottom Solder Paste" "Name": "Bottom Solder Paste" "Name": "Bottom Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Mask" "Notes": "Type: dielectric layer 1 (from F.Cu to B.Cu)" "Name": "Bottom Solder Paste" "Name": "Top Solder Mask" "Name": "Bottom Silk Screen.

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