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Handsoldering variant with enlarged pads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 20 leads; body width 6.1 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 28 leads; body width 4.4 mm; thermal pad LQFP, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002164B.pdf#page=68), generated with kicad-footprint-generator ipc_gullwing_generator.py.

/551D9380; Reference = P5.
Vertex -1.052940e+02 9.695134e+01 1.056119e+01 facet.
9774070943 (https://katalog.we-online.de/em/datasheet/9774070943.pdf), generated with kicad-footprint-generator Hirose.
Header, 2x38, 2.54mm pitch, DIN 41651.
(ii) assert any associated.

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