3
1
Back

Panel socket, through-hole, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 16-lead surface-mounted (SMD) DIP package, row spacing 5.08 mm (200 mils), body size 9.78x27.58mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 10x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), Socket 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300.

New Pull Request