Labels Milestones
BackPin, exposed pad: 4.5x8.1mm, with thermal pad (CP-16-22, http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_16_22.pdf LFCSP, 16 Pin (JEDEC MO-153 Var HB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator crystal Epson Toyocom FA-238 series https://support.epson.biz/td/api/doc_check.php?dl=brief_fa-238v_en.pdf, 3.2x2.5mm^2 package crystal Ceramic Resin Sealed SMD http://www.foxonline.com/pdfs/fe.pdf, 7.5x5.0mm^2 package crystal Epson Toyocom.
- Jacks, Stereo dual jack, full.
- Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-PasteTop.gtp Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/SolderWirePad_1x01_Drill1mm.kicad_mod Normal.
- WAGO 236-302 45Degree pitch 7.5mm size 15x11mm^2 drill.