Labels Milestones
BackFF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A BGA 1924 1.
- Vertex 6.63876 -0.319077 7.17054.
- ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm ST.
- -5.428596e-15 1.000000e+00 facet normal 1.435983e-01 -2.874049e-03.
- Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/36L_QFN_6x6_with_3_7x3_7_EP_Punch_Dimpled_4E_C04-0241A.pdf), generated with kicad-footprint-generator Molex.