Labels Milestones
Back5.4mmx5.2mm TDK NLV25, 2.5x2.0x1.8mm, https://product.tdk.com/info/en/catalog/datasheets/inductor_commercial_standard_nlv25-ef_en.pdf tdk nlv25 nlcv25 nlfv25 TDK NLV32, 3.2x2.5x2.2mm, https://product.tdk.com/info/en/catalog/datasheets/inductor_commercial_standard_nlv32-ef_en.pdf tdk nlv32 nlcv32 nlfv32 Inductor, TDK, SLF12555, 12.5mmx12.5mm (Script generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-162 , 2 pins, http://www.kingbright.com/attachments/file/psearch/000/00/00/L-2774GD(Ver.7B).pdf LED_Rectangular Rectangular Rectangular size 3.9x1.9mm^2 2 pins diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 3.0mm, 2 pins, pitch 7.5mm, size 47.3x14mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.farnell.com/datasheets/100425.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block WAGO 236-208 45Degree pitch 5mm size 65x9mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00076, 11 pins, pitch 5mm, size 10x9mm^2, drill diamater 1.5mm, 2 pads, pad diameter 2.7mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 16 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/16L_UQFN_4x4x0_5mm_JQ_C04257A.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 0.75 mm² wires, reinforced insulation, conductor diameter 0.4mm, outer diameter 3.5mm, size 53.5x8.3mm^2, drill diamater 1.4mm, pad diameter 2.7mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.15 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST PHD series connector, B4PS-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 0.127 mm² wires, reinforced insulation, conductor diameter 1.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST PHD series connector, 53398-1171 (http://www.molex.com/pdm_docs/sd/533980271_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 502386-0470 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 4, Wuerth electronics 9775076960 (https://katalog.we-online.com/em/datasheet/9775076960.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WQFN, 14 Pin (http://www.st.com/resource/en/datasheet/lsm6ds3.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HSOP, 8 Pin (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-8-27), generated with kicad-footprint-generator Molex CLIK-Mate series connector, SM12B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M1.6, height 3, Wuerth electronics 9771100360 (https://katalog.we-online.com/em/datasheet/9771100360.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 72 Pin (http://www.analog.com/media/en/technical-documentation/data-sheets/ADAU1452_1451_1450.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 46007-1104, 4 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B9P-VH-FB-B, shrouded (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Very Thin Dual Flatpack No-Lead Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA.
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