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Mils 8-lead surface-mounted (SMD) DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 32-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 18-lead though-hole mounted DIP package, row.

• Tie, 4 pin, 0.3mm round THT pads Net.
• -0.56635 -0.39288 0.724495 facet normal.
• //right_rib_x = width_mm - thickness*2; .
• -0.962628 -0.191527 facet normal.
• Connector, SM04B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with.

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