Labels Milestones
BackROHM MNR35 (see mnr_g.pdf Chip Resistor Network, ROHM MNR34 (see mnr_g.pdf Chip Resistor Network, ROHM MNR14 (see mnr_g.pdf Chip Resistor Array, Wave soldering, Vishay CRA06P (see cra06p.pdf Thick Film Chip Resistor Network, ROHM MNR15 (see mnr_g.pdf Chip Resistor Network, ROHM MNR18 (see mnr_g.pdf Precision Thin Film Chip Resistor Array, VISHAY (see http://www.vishay.com/docs/28770/acasat.pdf Chip Resistor Array, Wave soldering, Vishay CRA04P (see cra04p.pdf Chip Resistor Network, ROHM MNR34 (see mnr_g.pdf Chip Resistor Network, ROHM MNR32 (see mnr_g.pdf Chip Resistor Array, Wave soldering, Vishay CRA06P (see cra06p.pdf Thick Film Chip Resistor Network, ROHM MNR15 (see mnr_g.pdf Chip Resistor Array, VISHAY (see http://www.vishay.com/docs/28770/acasat.pdf Chip Resistor Network, ROHM MNR15 (see mnr_g.pdf Chip Resistor Network, ROHM MNR18 (see mnr_g.pdf SMT resistor net, Bourns CAT16 series, 2 way SMT resistor net Bourns CAT16 series, 4 way 3mm PLCC-2 PLCC-4 planar light pipe 4 way SMT resistor net, Bourns CAT16 series, 4 way SMT resistor net, Bourns CAT16 series, 4 way 3mm PLCC-2 PLCC-4 planar light pipe 1 way 3mm PhotoDiode, plastic SMD DIL, 4.5x4mm, area: 2.65x2.65mm, https://dammedia.osram.info/media/resource/hires/osram-dam-5467144/SFH%202430_EN.pdf PhotoDiode, plastic SMD DIL, 4.5x4mm² PhotoDiode plastic DIL RM5.08 PhotoTransistor, sidelooker package, RM2.54 PhotoTransistor sidelooker package RM2.54 package for Standex Meder DIP reed relay series, see https://standexelectronics.com/wp-content/uploads/datasheet_reed_relay_DIP.pdf DIL DIP PDIP 2.54mm 15.24mm 600mil 24-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD DIP Switch SPST Slide 6.15mm 242mil SMD 2x-dip-switch SPST Copal_CHS-02A, Slide, row spacing 15.24 mm (600 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD DIP Switch SPST 1P1T tactile switch SPST angled PTS645VL39-2 LFS C&K Button SW PUSH SMALL Tactile C&K.
- 14-pin zero insertion force socket, through-hole, horizontal.
- Connector, B10P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with.