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HTSSOP, 14 Pin (JEDEC MO-153 Var FD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0210, with PCB cutout.

• LFO. * PCB layout: make power connection.
• -0.0433039 0.0700998 0.9966 vertex 0.0206242.
• Inductor, https://productfinder.pulseelectronics.com/api/open/product-attachments/datasheet/p0599nl Shielded Molded High Current Inductor, body.

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