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[MSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 6 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic5353.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 44-Lead Plastic Quad Flatpack (MW) - 10x10x1.0 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad Variation; (see NXP sot054_po.pdf TO-92 leads molded, wide, drill 0.75mm (https://www.diodes.com/assets/Package-Files/TO92S%20(Type%20B).pdf TO-92S package, drill 0.6mm (https://media.digikey.com/pdf/Data%20Sheets/Infineon%20PDFs/KT,KTY.pdf TO-92S package, 2-pin, drill 0.75mm (see NXP sot054_po.pdf TO-92 2-pin leads in-line, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 32 leads; body width 3 mm; (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 10x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 22.86mm 900mil Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x4.1mm DIP Switch SPST Slide 5.25mm 206mil JPin SMD 1x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 1x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils 10-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils SMD DIP Switch SPST Slide 6.73mm 264mil SMD LowProfile SMD 4x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 5-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera BGA-153 M153 MBGA Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-169, 13x13 raster, 7x7mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/DM00366448.pdf WLCSP-168, 12x14 raster, 4.891x5.692mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf UFBGA-132, 12x12 raster, 7x7mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf UFBGA-100, 12x12 raster, 7x7mm package, pitch.

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