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FE Package; 16-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic Dual Flat, No Lead Package - 9x9 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 7.62.

0.111553 0.923213 vertex -3.49879.
0.980977 -4.03034e-07 vertex -3.16791 -1.29249 6.59.

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