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GHz Wi-Fi and Bluetooth module, https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32d_esp32-wroom-32u_datasheet_en.pdf 2.4 GHz Wi-Fi and Bluetooth combo chip https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32_datasheet_en.pdf Single 2.4 GHz Wi-Fi and Bluetooth module, https://www.espressif.com/sites/default/files/documentation/esp32-wroom-32e_esp32-wroom-32ue_datasheet_en.pdf NINA-B111 LGA module 42 Pin https://content.u-blox.com/sites/default/files/NINA-B1_DataSheet_UBX-15019243.pdf#page=30 NINA ublox u-blox b111 bluetooth nrf52840 module Omron Relay, SPST, https://gfinder.findernet.com/assets/Series/355/S32EN.pdf Finder 32.21-x300 Relay, SPST, https://gfinder.findernet.com/assets/Series/355/S32EN.pdf Finder 32.21-x300 Relay SPST Schrack-RT1 RM3.5mm 8A 250V AC Form C AXICOM IM-Series Relay J JLeg AXICOM HF3-Series Relay Pitch 1.27mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-8209-8-bit%20AVR%20ATmega16M1-32M1-64M1_Datasheet.pdf#page=426), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On Type FFC/FPC Connector, For LVDS, 2.33mm Height, Right Angle, Surface Mount Tactile Switch with High Contact Reliability, Side-actuated Model, without Ground Terminal, without Boss Ultra-small-sized Tactile Switch SPST Slide 7.62mm 300mil SMDSocket SmallPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 9x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 20-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 18-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 22-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 6x-dip-switch SPST Copal_CHS-06A, Slide, row spacing 15.24 mm (600 mils THT DIP DIL PDIP SMDIP 2.54mm 15.24mm 600mil 24-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 22.86mm 900mil SMDSocket SmallPads 64-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 16-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 10-lead though-hole mounted DIP package, row.

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