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56 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (http://www.ti.com/lit/ds/symlink/msp430g2001.pdf#page=43), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On Type FFC/FPC, 502250-3391, 33 Circuits (http://www.molex.com/pdm_docs/sd/5022441530_sd.pdf Molex 0.50mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0110, 11 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 43045-1821 (alternative finishes: 43045-140x), 7 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for a single 0.25 mm² wire, basic insulation, conductor diameter 1.25mm, outer diameter 2.1mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00045_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block.

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