Labels Milestones
Back5.475mm SOT-93 TO-220-2, Horizontal, RM 2.54mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Horizontal RM 2.54mm TO-220-4 Vertical RM 2.54mm TO-247-4, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Horizontal RM 1.7mm staggered type-2 TO-220-5, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 10.16mm 400mil LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 6-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm SMD DIP DIL PDIP 2.54mm 22.86mm 900mil Socket LongPads 24-lead though-hole mounted DIP package, row.
- Hand-soldering, 3.2x2.5mm^2 package SMD.
- 0.922563 -8.90914 3.82299 vertex -8.98903 0.111422 3.82299 facet.
- Vertex 7.99026 5.04122 3.54602 facet normal -1.600438e-001.
- Body [UQFN]; (see Microchip Packaging.