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Back(https://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT232H.pdf#page=49), generated with kicad-footprint-generator Molex PicoBlade side entry Molex JAE 0.2mm pitch, 1mm overall height FFC/FPC connector, FH12-26S-0.5SH, 26 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Pin Plastic Quad Flatpack (PT) - 7x7x1.0 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf DFN package size 0604 3 pins Ceramic Resomator/Filter Murata TPSKA, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, 7.9x3.8mm^2 package SMD Crystal TXC 9HT11 http://txccrystal.com/images/pdf/9ht11.pdf, 2.0x1.2mm^2 package SMD Crystal Seiko Epson MC-146 https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-156_en.pdf, hand-soldering, 6.7x1.5mm^2 package SMD Crystal Seiko Epson MC-306 https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-306_en.pdf, hand-soldering, 9.6x4.1mm^2 package SMD Crystal EuroQuartz MQ series http://cdn-reichelt.de/documents/datenblatt/B400/MQ.pdf, hand-soldering, 7.0x5.0mm^2 package FOX SMD Crystal Seiko Epson SG-8002LB https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC, 5.0x3.2mm^2 package Ultraminiature Crystal Clock Oscillator ECS 2520MV series, https://www.ecsxtal.com/store/pdf/ECS-2520MV.pdf Miniature Crystal Clock Oscillator TXC 7C series, http://www.txccorp.com/download/products/osc/7C_o.pdf, 5.0x3.2mm^2 package 14-lead dip package, row spacing 7.62 mm (300 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 20-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 48-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 32-lead dip package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 8x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil Socket 4-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf E-Switch slide switch, OS series, SPDT, https://www.e-switch.com/wp-content/uploads/2022/06/EG.pdf tactile switch, 7.3mm x 6.25mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f031k6.pdf.
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