Labels Milestones
BackDFN, 4mm x 3mm MLF - 3x3x0.85 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see.
- Pitch 13.00mm diameter 7.7978mm Diameter9-5mm.
- 0.0928906 0.995676 vertex 0.703367 -9.38579 20.0916 vertex.
- 5.81619 7.55007 vertex 5.79165 -4.46475.