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BackE Package eSIP-7F Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab https://ac-dc.power.com/sites/default/files/product-docs/linkswitch-ph_family_datasheet.pdf SIP4 Footprint for Mini-Circuits case MMM168, Land pattern PL-225, vias included, (case drawing: https://ww2.minicircuits.com/case_style/CD542.pdf, land.
- Normal 0.111554 0.367742 0.923213 facet normal 0.39254.
- DA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator.