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(https://www.onsemi.com/pub/Collateral/FUSB302B-D.PDF#page=32), generated with kicad-footprint-generator Soldered wire connection, for 5 times 2 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 3.5mm, size 31.5x7.6mm^2, drill diamater 1.5mm, 2 pads, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00287_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block Metz Connect Type205_RT04504UBLC 45Degree pitch 10mm Varistor, diameter 21.5mm, width 5.1mm, pitch 10mm size 45x9mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00247, 8 pins, pitch 5mm, size 25x9.8mm^2, drill diamater 1.3mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00055, 12 pins, pitch 5.08mm, see https://www.centralsemi.com/PDFS/CASE/TO-220-2PD.PDF TO-220-2 Vertical RM 2.54mm staggered type-1 TO-220F-11, Vertical, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Horizontal RM 2.54mm TO-220-4 Horizontal RM 2.54mm TO-220-3, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5 TO-220F-5 Vertical RM 2.54mm staggered type-1 TO-220-9, Horizontal, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 2.54mm TO-247-4, Vertical, RM 2.54mm, see https://www.vishay.com/docs/66542/to-220-1.pdf TO-220-3 Horizontal RM 2.54mm TO-220-3, Vertical, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220F-4, Vertical, RM 2.286mm SIPAK Horizontal RM 2.54mm staggered type-1 TO-220F-4, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 2.54 4-lead dip package for diode bridges, row spacing 10.16 mm (400 mils), LongPads 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 6x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 12-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 18-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils 5-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 16-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 5x-dip-switch SPST , Piano, row spacing 7.62.

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