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Jing Tuo Jin Electronics Co 918-118A2021Y40002 ( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads THT DIP DIL ZIF 25.4mm 1000mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL ZIF 7.62mm 300mil.

• -0.896427 21.7998 vertex -4.94225 0.762348 21.7809 facet.
• -0.0169529 -0.828691 0.559449 facet normal -0.0154455 -0.484683.

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