Labels Milestones
BackIpc_noLead_generator.py mlf 8 2x2 mm 16-Lead Quad Flat, No Lead Package - 3x3 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 16 12 Wide.
- Wafer level chip-size package; 15 bumps.
- 0.990436 -0.097579 0.0975395 facet normal.
- -1.084626e+02 9.695134e+01 1.068604e+01 facet normal 9.939718e-01 3.310102e-03 1.095858e-01.