Labels Milestones
Back16 leads; body width 4.4 mm; Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Quad Flat, No Lead Package (MC) - 2x3x0.9 mm Body [QFN] with thermal vias; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf UFBGA-132, 12x12 raster, 7x7mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00340475.pdf WLCSP-66, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf LFBGA-144, 12x12 raster, 10x10mm package, pitch 0.65mm WLP-4, 2x2 raster, 0.73x0.73mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 483, 3.73x4.15mm, 115 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row Through hole pin header SMD 2x16 2.54mm double row Through hole straight socket strip, 1x03, 1.00mm pitch, 2.0mm pin length, double rows Through hole angled pin header, 2x17, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 1x36 2.00mm single row Through hole angled pin header THT 1x35 1.27mm single row male, vertical entry, with latches, PN:G125-MVX3405L1X Harwin Gecko Connector, 50.
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