Labels Milestones
Back3.141x3.127mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l072kz.pdf WLCSP-49, 7x7 raster, 2.965x2.965mm package, pitch 0.8mm; https://www.nxp.com/docs/en/package-information/SOT1529-1.pdf Altera BGA-672 F672 FBGA WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.5mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition.
- Large Pads, http://cdn-reichelt.de/documents/datenblatt/B400/OSZI.pdf Oscillator, DIP14, Large.
- Iso14580 Mounting Hole 2.2mm.
- Vendor? VCF MK's Diode Ladder VCF Kassutronic's.
- MOSFET package, 3x3mm (see https://www.fairchildsemi.com/datasheets/FD/FDMC8032L.pdf Fairchild-specific.
- 0.2 -0.35 (end -0.5 0 (end -0.3.