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1x09 1.27mm single row style1 pin1 left Surface mounted pin header THT 1x11 1.27mm single row Through hole straight pin header, 1x20, 1.27mm pitch, 4.0mm pin length, single row Through hole angled pin header SMD 1x02 2.00mm single row Through hole straight pin header, 1x35, 2.54mm pitch, single row style2 pin1 right Through hole angled pin header THT 2x07 2.54mm double row surface-mounted straight pin header, 1x12, 2.54mm pitch, 8.51mm socket length, single row style2 pin1 right Through hole straight pin header, 1x08, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header THT 1x14 5.08mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 1x01, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series 11.94mm post length, 1x17, 5.08mm pitch, single row Surface mounted pin header SMD 2x37 2.00mm double row surface-mounted straight socket strip, 2x25, 2.00mm pitch, single row Through hole straight socket strip, 2x25, 1.27mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted socket strip SMD Solder Jumper, 1x1.5mm, rounded Pads, 0.3mm gap, open, labeled with numbers LUMILEDS LUXEON TX L1T2 LED LED 1W 3W 5W LED SMD https://www.kingbrightusa.com/KCpack.asp?txtPack=APHBM2012 Kingbright, dual LED, 3.5 x 2.8 mm Surface Mount Tactile Switch SPST Slide 5.25mm 206mil JPin SMD DIP DIL PDIP 2.54mm 15.24mm 600mil SMDSocket SmallPads 24-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 Lattice caBGA-756, ECP5 FPGAs, 27.0x27.0mm, 756 Ball, 32x32 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (area) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.5mm; see section 6.2 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.8mm; https://www.nxp.com/docs/en/package-information/SOT1529-1.pdf Altera BGA-672 F672 FBGA WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-49, 7x7 raster, 3.89x3.74mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf WSON 8.

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