Labels Milestones
Back20-Pin Thermally Enhanced Thin Shrink Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SSO Stretched SO SOIC Pitch 2.54 SSO Stretched SO SOIC Pitch 2.54 SSO Stretched SO SOIC Pitch 1.27 SSOP-8.
- High-volatge DIP package (based on standard.
- 799 .../precadsr-panel-drl_map.pdf | Bin 0 -> 69774.
- 5; row_1 = bottom_row + v_margin + 12.
- Connector, 53780-0470 (), generated.
- (http://www.ti.com/lit/ds/symlink/bq24133.pdf#page=40 Texas Instruments, NDQ, 5 pin.