Labels Milestones
BackTemp_* # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole) Total plated holes Total unplated holes count 16 ============================================================= Total unplated holes count 16 ============================================================= Total unplated holes count 16 Not plated through holes: ============================================================= T1 3.200mm 0.1260.
- -5.730144e-001 0.000000e+000 vertex -6.461357e+000 2.791791e+000 2.496000e+001.
- + unplated, and revises jack footprint a3181ad06b.
- 5.3mm, M5, ISO7380 mounting.