Labels Milestones
Back14hp PCB initial layout, no traces "min_copper_edge_clearance": 0.0, PCB initial layout, no traces "min_copper_edge_clearance": 0.0, PCB initial layout, no traces "silk_text_size_h": 1.0, "silk_text_size_v": 1.0, "silk_text_thickness": 0.15, "silk_text_upright": false, "zones": { "min_clearance": 0.5 } }, updates to rev 2 beta edits README.md | 1 | SW_DPDT_x2 | Switch, triple pole double throw, right angle, stacked (https://www.molex.com/content/dam/molex/molex-dot-com/products/automated/en-us/salesdrawingpdf/484/48406/484060001_sd.pdf USB 3.0 Micro B horizontal USB Micro-B receptacle, horizontal, SMD, 10118193, with flange, https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10118193.pdf Dustproof Micro USB https://gct.co/files/drawings/usb3076.pdf Micro-USB SMD Typ-B GCT Molex Vertical Micro USB Type C Plug Shenzhen Jing Tuo Jin Electronics Co 918-118A2021Y40002 ( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 5, row spacing 7.62 mm (300 mils), Socket 10-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 12-lead.
- -0.80502 0.0993387 vertex -5.09939 -6.16411 20.
- Vertex -1.018688e+02 9.327779e+01 3.455000e+01 vertex -9.657885e+01 9.175388e+01 1.855000e+01.
- 0.301613 9.71631 3.26879 facet.
- 4 .../PCB/precadsr_Gerbers/precadsr-B_Paste.gbr | 4.