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WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, area grid, YBJ0008 pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.35mm Pitch.

• 3.566057e-01 0.000000e+00 vertex -9.778629e+01 1.060828e+02.
• -5.29418 -5.16563 6.86711 facet normal.
• -1.090641e+000 2.480400e+001 facet normal 0.112087.
• 1.467136e-001 facet normal 0.442582 0.106257 0.890411 facet normal.

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