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9 lines main synth_tools/Schematics/SynthMages.pretty/3.5mm_jack_hole_nonpcb.kicad_mod 24 lines Binary files /dev/null and b/Panels/Font files/Futura XBlk BT.ttf and /dev/null differ Binary files /dev/null and b/3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/SPIDER CLIMB.png 8576ad9482 Added input resistor for sync; placed everything on PCB sandwich, making some final-ish decisions about connecting to front panel design and includes 2.5mm centerward shift for input and output jacks Latest commits for file Panels/FireballSpell.dxf 99b8f1493d Go to file 56529bef3a Updates from real TL0x4s re-re-remove the mysterious extra trace 5040873587dbb57684343269abab88d35cf7124b Update Schematics/schematic_bugs_v1.md Clock POT is too small for a single 0.15 mm² wires, reinforced insulation, conductor diameter 2.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Hirose DF11 through hole, DF13-03P-1.25DSA, 3 Pins per row (https://www.molex.com/pdm_docs/sd/430450201_sd.pdf), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Tactile Switch for High-Density Packaging with Ground Terminal, without Boss Ultra-small-sized Tactile Switch with High Contact Reliability, Side-actuated Model, with Ground Terminal Middle Stroke Tactile Switch SPST Slide 8.61mm 338mil SMD LowProfile SMD 6x-dip-switch SPST , Piano, row spacing 5.9 mm (232 mils), body size 9.78x14.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 3x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils SMD DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 3M 16-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 10x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP 2.54mm 26.669999999999998mm 1050mil SMDSocket LongPads 28-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil 4-lead though-hole mounted DIP package, row.

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