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24-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size 10.8x4.1mm DIP Switch SPST Piano 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET MX MOSFET Infineon DirectFET SJ MOSFET Infineon DirectFET L8 MOSFET Infineon DirectFET L6 MOSFET Infineon DirectFET L6 MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET SQ MOSFET Infineon DirectFET SB MOSFET Infineon DirectFET MZ MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET SJ MOSFET Infineon DirectFET L8 MOSFET Infineon DirectFET SC MOSFET Infineon DirectFET S1 MOSFET Infineon DirectFET MZ MOSFET Infineon DirectFET SH MOSFET Infineon DirectFET MT MOSFET Infineon DirectFET MB MOSFET Infineon DirectFET MQ MOSFET Infineon PLCC, 20 pins, surface mount PLCC, 52 pins, through hole 2.7mm, height 5.5, Wuerth electronics 9771060360 (https://katalog.we-online.com/em/datasheet/9771060360.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 4, Wuerth electronics 9774100982 (https://katalog.we-online.de/em/datasheet/9774100982.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 8, Wuerth electronics 97730356330 (https://katalog.we-online.com/em/datasheet/97730356330.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 22-27-2061, 6 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-0102, With thermal vias in pads, 4 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated.

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