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Sot370-1_po.pdf SSOP56: plastic shrink small outline package; 28 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf TSSOP, 44 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-1104, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 3.5, Wuerth electronics 9771110360 (https://katalog.we-online.com/em/datasheet/9771110360.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0210, with PCB locator, 8 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 16 Pin (https://www.haloelectronics.com/pdf/discrete-ultra-100baset.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 5273-11A example for new part number: A-41791-0016 example for new part number: 5273-10A example for new mpn: 39-30-0080, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP8: plastic thin shrink small outline package; 16 leads; body width 4.4 mm; thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flatpack - 10x10x2.5mm Body (http://www.onsemi.com/pub/Collateral/122BK.PDF PQFP80 14x20 / QIP80E CASE 122BS (see ON Semiconductor 506AF.PDF DKD Package; 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 10.8x29.5mm 11x-dip-switch SPST CTS_Series194-11MSTN, Piano, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-Lead Plastic Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SO, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20005474E.pdf#page=25), generated with.

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