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(https://www.diodes.com/assets/Package-Files/U-DFN2020-6-Type-F.pdf HVQFN, 16 Pin (http://www.thatcorp.com/datashts/THAT_1580_Datasheet.pdf), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-14DP-0.5V, 14 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32 Pin (https://www.analog.com/media/en/package-pcb-resources/package/414143737956480539664569cp_32_2.pdf), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-50DP-0.5V, 50 Pins (http://www.molex.com/pdm_docs/sd/5019204001_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-148-02-xxx-DV, 48 Pins per row (http://www.molex.com/pdm_docs/sd/428202214_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py DSO DSO-8 SOIC SOIC-8 Infineon PG-DSO 12 pin, exposed pad: 4.5x8.1mm, with thermal pad TSSOP HTSSOP 0.65 thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 16 leads; body width 4.4 mm; (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 temperature sensor diode TO-92 horizontal, leads molded, narrow, drill 0.75mm (http://www.produktinfo.conrad.com/datenblaetter/175000-199999/181293-da-01-de-TO92_Temperatursensor_PT1000_32209225.pdf Molded Japan Transistor Package 7x4x9mm^3, http://rtellason.com/transdata/2sb734.pdf Non Isolated Modified TO-220 7pin Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-2 TO-220F-9 Vertical RM 2.54mm TO-220-4, Horizontal, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-2 Vertical RM 2.54mm TO-251-2, Horizontal, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 1.27mm staggered type-1 TO-220-7 Horizontal RM 2.286mm SIPAK Horizontal RM 10.95mm SOT-93 TO-218-2, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 4.58mm IPAK TO-251-3, Vertical, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-4 Horizontal RM 5.08mm TO-220-2, Vertical, RM 0.9mm, staggered type-2 TO-220-15, Vertical, RM 1.27mm, staggered type-1 TO-220F-11, Vertical, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Horizontal RM 4.58mm IPAK TO-251-2, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 2.54 4-lead dip package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x4.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 2x-dip-switch SPST Copal_CVS-02xB, Slide, row spacing 8.89 mm (350 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 10x-dip-switch SPST Copal_CHS-10A, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size 10.8x21.88mm 8x-dip-switch SPST , Slide.

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