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97730606334 (https://katalog.we-online.com/em/datasheet/97730606334.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 53047-1510, 15 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator ipc_noLead_generator.py Analog LFCSP, 16 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ri_soic_ic/ri_16_1.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 32 Pin (https://www.ti.com/lit/ds/symlink/bq25703a.pdf#page=90), generated with kicad-footprint-generator Fuse SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SO, 14 Pin (http://www.ti.com/lit/ds/symlink/lm5161.pdf#page=34), generated with kicad-footprint-generator Soldered wire connection, for 5 times 0.5 mm² wires, basic insulation, conductor diameter 1.7mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.25 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.75 mm² wire, basic insulation, conductor diameter 1.4mm, outer diameter 3.5mm, size 24.5x7.6mm^2, drill diamater 1.3mm, pad diameter 2.5mm, hole diameter 1.5mm THT pad as test Point, diameter 1.0mm THT rectangular pad as test Point, square 1.0mm side length, hole diameter 1.3mm, hole diameter 1.0mm, hole diameter 0.5mm test point THT pad as test.

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