3
1
Back

MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 20-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package.

New Pull Request