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1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, WSON-8, http://www.ti.com/lit/ds/symlink/lm27761.pdf WSON 8 1EP ThermalVias WSON, 8 Pin (https://www.ti.com/lit/ds/symlink/lp2951-n.pdf), generated with kicad-footprint-generator Capacitor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0210, with PCB locator, 9 Pins per row (http://www.molex.com/pdm_docs/sd/439151404_sd.pdf), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MSTB_2,5/5-GF-5,08; number of pins: 05; pin pitch: 5.08mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x4.5 C or ISO 7049-ST 2.2x4.5 C or ISO 7049-ST 2.2x6.5 C or ISO 7049-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1803426 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/12-GF-3.5; number of pins: 09; pin pitch: 5.08mm; Angled || order number: 1766686 12A 630V Generic Phoenix Contact connector footprint for: GMSTBV_2,5/3-GF-7,62; number of pins: 05; pin pitch: 7.62mm; Vertical; threaded flange || order number: 1803549 8A 160V Generic Phoenix Contact connector footprint for: MSTB_2,5/10-GF-5,08; number of pins: 05; pin pitch: 5.08mm; Angled || order number: 1843237 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/5-G-3.81; number of pins.

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