3
1
Back

12-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with Korean HRO Parts Elec TYPE-C-31-G-06 USB Type-C Plug Edge Mount SMB pcb mounting jack Hirose U.FL Coaxial https://www.hirose.com/product/en/products/U.FL/U.FL-R-SMT-1%2810%29/ Molex Microcoaxial RF Connectors (MCRF), mates Hirose U.FL, (http://www.molex.com/pdm_docs/sd/734120110_sd.pdf mcrf hirose ufl u.fl microcoaxial DIN41612 connector, type C/2, Horizontal, 3 rows 16 pins wide, https://www.erni-x-press.com/de/downloads/kataloge/englische_kataloge/erni-din41612-iec60603-2-e.pdf DIN 41612 IEC 60603 B/2 DIN41612 connector, type.

New Pull Request