3
1
Back

42-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD DIP Switch SPST Slide 7.62mm 300mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 24-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads.

New Pull Request