synth_tools

Back

MCV_1,5/6-GF-3.5; number of pins: 09; pin pitch: 7.50mm; Angled || order number: 1843347 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/13-GF-3.5; number of pins: 09; pin pitch: 3.81mm; Vertical; threaded flange || order number: 1803390 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/3-GF-5.08; number of pins: 08; pin pitch: 5.08mm; Angled || order number: 1776812 12A Generic Phoenix Contact connector footprint for: MCV_1,5/9-G-5.08; number of pins: 14; pin pitch: 7.62mm; Angled || order number: 1844359 8A 160V Generic Phoenix Contact SPT 2.5/2-H-5.0-EX Terminal Block, 1719367 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719367), generated with kicad-footprint-generator ipc_gullwing_generator.py PQFP, 112 pins, 20mm sq body, 0.65mm pitch (http://cache.freescale.com/files/shared/doc/package_info/98ASS23330W.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf PQFP, 132 pins, 24mm sq body, 0.635mm pitch (https://www.intel.com/content/dam/www/public/us/en/documents/packaging-databooks/packaging-chapter-02-databook.pdf, http://www.nxp.com/docs/en/application-note/AN4388.pdf PQFP, 132 pins, 24mm sq body, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 16-Lead Plastic Shrink Small Outline (SM) - 5.28 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 14-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 11x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads THT DIP DIL ZIF 7.62mm 300mil 8-lead dip package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 22.86mm 900mil SMDSocket SmallPads 40-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads 5-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera BGA-153 M153 MBGA Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.4mm; see section 6.1 of http://www.st.com/resource/en/datasheet/stm32f405og.pdf WLCSP-100, 10x10 raster, 4.201x4.663mm.

New Pull Request

Labels Milestones