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BackBody, 9.5mm sq thermal pad with vias HTSSOP, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc2535.pdf#page=164), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-132 , 2 pins, diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 2.0mm 2 pins LED, diameter 10.0mm, 3 pins, pitch 10.2mm, size 66x8.3mm^2, drill diamater 1.5mm, 2 pads, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00023_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00017 pitch 5mm size 45x7.6mm^2 drill 1.3mm pad.
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